Tag: Tungsten Titanium Alloy Target

Tungsten Titanium Alloy Target for Chips

0 Comment

Tungsten Titanium Alloy Target for Chips The main reason why new semiconductor chips choose tungsten titanium alloy targets as the diffusion barrier and bonding layer is that the alloy has good surface adhesion and excellent heat dissipation properties. In this way, the prepared product will have a higher comprehensive performance. Tungsten-titanium alloy is an alloy that […]

Tags: , , , , , , , , , ,