Tungsten Copper Alloy for Electronic Packaging Materials
Tungsten Copper Alloy for Electronic Packaging Materials Tungsten copper alloy (W-Cu alloy) is an alloy that combines the advantages of tungsten and copper. Specifically, it not only has the characteristics of high melting point, high density, and low expansion coefficient of metal tungsten but also good electrical and thermal conductivity properties of metal copper, so […]
Tags: Advanced Refractory Metals, ARM, Electronic Packaging Materials, refractory alloys, Refractory Metals, supplier of refractory alloys, supplier of refractory metals, Tungsten Copper Alloys, Tungsten Powder, W-Cu alloys