Tag: Electronic Packaging Materials

Tungsten Copper Alloy for Electronic Packaging Materials

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Tungsten Copper Alloy for Electronic Packaging Materials Tungsten copper alloy (W-Cu alloy) is an alloy that combines the advantages of tungsten and copper. Specifically, it not only has the characteristics of high melting point, high density, and low expansion coefficient of metal tungsten, but also good electrical and thermal conductivity properties of metal copper, so […]

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