Advanced Refractory Metals specializes in producing high purity Tantalum Lump with the highest possible density and smallest possible average grain sizes for use in Chemical Vapor Deposition (CVD) and Physical Vapor Deposition (PVD) processes. Our standard lump pieces are amorphous uniform pieces in sizes ranging from 5-15 mm. Lump materials are produced using crystallization, solid state and other ultra high purification processes such as sublimation.
Tantalum Lump Properties (Theoretical)
|Melting Point||3017 °C|
|Boiling Point||5458 °C|
|Density||16.69 g/cm3 (20 °C)|
|Crystal Phase / Structure||α: body-centered cubic (bcc) / β: tetragonal|
|Electrical Resistivity||131 nΩ·m (20 °C)|
|Heat of Fusion||36.57 kJ/mol|
|Heat of Vaporization||753 kJ/mol|
|Specific Heat||140 J/kg·K|
|Thermal Conductivity||57.5 W/m·K|
|Thermal Expansion||6.3 µm/m·K|
|Vickers Hardness||870–1200 MPa|
|Young's Modulus||186 GPa|
* Used in laboratory equipment.
* Used as a substitute for platinum.
* Used in manufacturing superalloys and electron-beam melting.
* Used in metallurgical, machinery processing, glass and ceramic industries.
* Used as a superalloy additive in nickel-based alloys.
* Used for sputtering targets.
Our tantalum lump is carefully handled during storage and transportation to preserve the quality of our product in its original condition.
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